5 Minutes TSV copper electrodeposition

摘要

TSV(Through Silicon Via) is promising interconnection for the next generation smartphone, driving assistance and medical care system because of its ability of high speed image processing and low energy consumption. Conventional TSV electrodeposition requires several 10 minutes to hour because of applying small current of less than 10 mA/cm. We are able to electrodeposit the 6 μm diameter and depth of 25 μm TSV via within 5 minutes. A very high on current of 90 mA/cm is able to apply without void formation.