ASE Group, Product Characterization, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan;
electromigration; electronics packaging; failure analysis; fine-pitch technology; flip-chip devices; solders; tin compounds; SnAg; current stressing; electrical resistance; electronic products; failure behavior; fine pitch bump; flip chip package; solder bump; solder joints; temperature 150 degC; temperature 160 degC; Electromigration; Flip-chip devices; Market research; Resistance; Substrates; Temperature measurement; Tin; Electromigration; SnAg; fine pitch;
机译:键合参数对微间距Cu / Ni / SnAg微凸点微芯片芯片间互连可靠性的影响
机译:电流应力作用下Cu / Sn / Cu系统细间距微凸点的破坏机理
机译:电流应力过大条件下Sn-3.5Ag焊块的异常失效行为
机译:电流应力下细间距陷阱凸块的故障行为
机译:主应力方向和中间主应力对交叉各向异性细砂矿床应力-应变-强度行为的影响。
机译:抑制间距标签:没有迹象是对听觉GO / Nogo任务中的认知抑制的行为和神经生理学措施的影响没有证据
机译:对变形行为和拉伸诱导失效或细间距可拉伸互连的现场观察
机译:薄基板,精细凸块间距和小型原型模具的倒装芯片组装。