Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration

摘要

Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and −2.0 µm in X and Y directions.