Flip Chip Bonding Apparatus and Solder Ball Bonding Apparatus Using VCSEL Device

摘要

The present invention relates to a flip-chip bonding device using a big-cell device, and more particularly, to a flip-chip bonding device using a big-cell device for bonding a flip-chip semiconductor chip to a substrate using infrared laser light generated from the big cell device. it's about The flip-chip bonding apparatus using a big cell device according to the present invention has the effect of bonding a semiconductor chip to a substrate with high productivity and quality by controlling laser light quickly and quickly.