首页> 外文会议>2012 Proceedings of the European Solid-State Device Research Conference. >A gate-last In0.53Ga0.47As channel FinFET with Molybdenum source/drain contacts
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A gate-last In0.53Ga0.47As channel FinFET with Molybdenum source/drain contacts

机译:带有钼源极/漏极触点的后栅极In0.53Ga0.47As通道FinFET

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We demonstrated In0.53Ga0.47As channel FinFETs with self-aligned Molybdenum (Mo) contacts for the first time. By using self-aligned Mo contacts formed on in-situ doped n++ In0.53Ga0.47As source and drain, series resistance of ∼250 Ω·μm was achieved, which is the lowest value ever reported for In0.53Ga0.47As non-planar devices. A gate-last process was used. FinFET with channel length of 500 nm and EOT of 3 nm has an ION/IOFF of over 105 and peak Gm of 255 μS/μm at VD = 0.5 V.
机译:我们首次展示了具有自对准钼(Mo)触点的In0.53Ga0.47As通道FinFET。通过使用在原位掺杂的n ++ In0.53Ga0.47作为源极和漏极上形成的自对准Mo触点,可实现约250Ω·μm的串联电阻,这是有史以来的最低值。用于In0.53Ga0.47As非平面器件。使用后栅极工艺。 FinFET的沟道长度为500 nm,EOT为3 nm,在VD = 0.5 V时,其ION / IOFF超过10 5 ,峰值Gm为255μS/μm。

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