Department of Mechanical Engineering Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong;
Department of Mechanical Engineering Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong;
Henkel Corporation 15350 Barranca Parkway Irvine, CA 92618, USA;
Henkel Corporation 15350 Barranca Parkway Irvine, CA 92618, USA;
Henkel Corporation 15350 Barranca Parkway Irvine, CA 92618, USA;
Henkel Corporation 15350 Barranca Parkway Irvine, CA 92618, USA;
QFN; button shear test; stress ratio criterion; MSL test; C-SAM inspection;
机译:从模型到低噪声放大器单片微波集成电路:0.03-2.6 GHz塑料四扁平无铅包装镓 - 氮化物低噪声放大器单片微波集成电路
机译:印刷电路板上偏心四扁平无铅封装平均压模的分析热阻模型
机译:采用组合实验和仿真方法预测四边形无铅封装中的分层失效
机译:四扁平无铅(QFN)包装材料选择与湿度敏感水平的相关性
机译:使用四点循环弯曲测试和热循环测试的四方扁平无铅封装(QFN)封装的寿命预测之间的关系
机译:水分对纤维素纳米晶体在软包装材料上作为高阻气涂层的影响
机译:制造应力对四方扁平无铅叠层芯片封装中芯片附着膜性能的影响
机译:知识体系(BOK)用于无引线四方扁平无引线/底部端接元件(QFN / BTC)封装趋势和可靠性。