Multiple Line Grid Array (MLGA) Package

摘要

A new concept of IC package called as the MLGA package is introduced for the first time. The MLGA package has an array of leads which are different from conventional balls and pins for BGA and PGA packages, respectively. The lead, we call it as the grid, contains multiple I/Os per each grid which can be made of any kind of insulating materials and any kind of shapes. Our evaluation on the MLGA package shows that it has 20 ～ 50% less package area, ～ 35% higher resonant frequency, ～ 20% better thermal dissipation than respective characteristics of the BGA packages, while satisfying reliability of solder joints on the grids. Since the MLGA package has better mutability than BGA package, it only uses less layers of substrate which eventually leads to a lower substrate cost and packaging cost. There should be versatile applications from the basic concept of the MLGA package and we continue to search for the best suited design to meet the future demands for advanced performances and applications in electronic devices.