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Vertical GaN MOSFETs with Over 1.6 kV breakdown voltage: A theoretical studying

机译:击穿电压超过1.6 kV的垂直GaN MOSFET的理论研究

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摘要

In this paper, influences of key parameters on DC characteristics of vertical GaN MOSFETs are investigated. There is a difference between the simulation and theoretical results that the breakdown voltage increases with the p-doping concentration increasing. The structure of high voltage GaN MOSFETs is also optimized, and the breakdown voltage is up to 1602 V.
机译:本文研究了关键参数对垂直GaN MOSFET直流特性的影响。模拟和理论结果之间存在差异,即击穿电压随p掺杂浓度的增加而增加。高压GaN MOSFET的结构也得到了优化,击穿电压高达1602 V.

著录项

  • 来源
  • 会议地点 Xian(CN)
  • 作者单位

    Wide Bandgap Semiconductor Technology Disciplines State Key Laboratory, School of Microelectronic, Xidian University, Xi'an, China;

    Wide Bandgap Semiconductor Technology Disciplines State Key Laboratory, School of Microelectronic, Xidian University, Xi'an, China;

    Wide Bandgap Semiconductor Technology Disciplines State Key Laboratory, School of Microelectronic, Xidian University, Xi'an, China;

    School of Information Science and Technology, Northwest University, Xi'an, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Doping; Gallium nitride; MOSFET; Electric breakdown; Substrates;

    机译:掺杂;氮化镓; MOSFET;电击穿;基板;;
  • 入库时间 2022-08-26 14:32:26

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