首页> 外文会议>10th Annual Symp on Microlithography >Evaluation of a high-resolution negative-acting electron-beam resist GMC for photomask manufacturing
【24h】

Evaluation of a high-resolution negative-acting electron-beam resist GMC for photomask manufacturing

机译:评估用于光掩模制​​造的高分辨率负作用电子束抗蚀剂GMC

获取原文
获取原文并翻译 | 示例

摘要

Abstract: As mask and reticle designs continue to evolve in complexity and resolution requirements, maskmakers are investigating what advantages negative acting electron beam resists may have in meeting these requirements. One candidate is Poly (glycidyl methacrylate-co-3- chlorostyrene), GMC, which is an advanced negative resist used for the purpose of photomask fabrication. In this paper, a statistically designed experiment will be described in which GMC resist was evaluated for use on the MEBES system. Variables explored included exposure dosage, chrome etch time, resist descum and strip time. The effects of these variables on defect density, critical dimension (CD) size and uniformity will be presented.!
机译:摘要:随着掩模和标线设计的复杂性和分辨率要求不断提高,掩模制造商正在研究负作用电子束抗蚀剂在满足这些要求方面可能具有哪些优势。一种候选物是聚(甲基丙烯酸缩水甘油酯-co-3-氯苯乙烯),GMC,它是一种先进的负性抗蚀剂,用于光掩模的制造。在本文中,将描述统计设计的实验,其中评估了GMC抗蚀剂在MEBES系统上的使用。探索的变量包括曝光剂量,铬蚀刻时间,抗浮渣和剥离时间。将介绍这些变量对缺陷密度,临界尺寸(CD)大小和均匀性的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号