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Dielectric breakdown in ultra-thin Hf based gate stacks : a resistive switching phenomenon

机译:超薄H型栅堆叠中的介电击穿:电阻切换现象

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摘要

In this work, the temperature dependence of the resistive switching-related currents (gate and drain) in MOSFETs with ultra-thin Hf based high-k dielectric has been analyzed, for the two dielectric conductivity states. The two different conductive states of the resistive switching have been associated to the breakdown (BD) and BD recovery of the dielectric. The results about the temperature dependence of the post-BD gate current are in agreement with those obtained from the study of the injected charge to recovery, a useful parameter to analyze the switch from the high to the low conductivity state. The drain current in the MOSFETs, for the two conductivity states, for different locations of the BD path along the channel (source and drain) and several temperatures has also been studied. The results are a contribution for a better understanding of the resistive switching phenomenon in ultra-thin gate dielectrics, which could be useful for the developing of models to describe BD reversibility.
机译:在这项工作中,针对两种介电导率状态,分析了具有超薄Hf基高k电介质的MOSFET中与电阻开关相关的电流(栅极和漏极)的温度依赖性。电阻切换的两种不同导电状态已与电介质的击穿(BD)和BD恢复相关联。关于BD后栅极电流的温度依赖性的结果与从注入电荷到恢复的研究获得的结果一致,这是分析从高电导率状态到低电导率状态转换的有用参数。对于两个导电状态,沿着通道的BD路径的不同位置(源极和漏极)以及几个温度,MOSFET中的漏极电流也已进行了研究。这些结果有助于更好地理解超薄栅极电介质中的电阻开关现象,这可能有助于开发描述BD可逆性的模型。

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