首页> 外国专利> EPITAXIAL WAFER, METHOD OF MANUFACTURING EPITAXIAL WAFER, DIODE, AND CURRENT RECTIFIER

EPITAXIAL WAFER, METHOD OF MANUFACTURING EPITAXIAL WAFER, DIODE, AND CURRENT RECTIFIER

机译:外延片,制造外延片的方法,二极管和电流整流器

摘要

An epitaxial wafer, a method of manufacturing the epitaxial wafer, a diode, and a current rectifier. The epitaxial wafer comprises a Si substrate layer (11); an insulating layer (12) formed on the Si substrate layer (11); and a nitride semiconductor layer (13) formed on a surface of the insulating layer (12) facing away from the Si substrate layer (11); wherein the insulating layer (12) has a thickness configured such that under a forward bias voltage, the insulating layer (12) may allow electrons and holes to pass from one side to the other side of the insulating layer (12) via quantum tunneling so as to allow a forward current flow. Under reverse bias, the insulating layer (12) can hinder formation of free electrons and holes so as to block a reverse current. Thus, the epitaxial wafer is enabled to have the characteristic of allowing passage of a current only in one direction and can be made into a diode or the like for a current rectifying component.
机译:一种外延晶片,一种制造该外延晶片的方法,一个二极管和一个电流整流器。外延晶片包括硅衬底层(11);形成在硅衬底层(11)上的绝缘层(12);以及氮化物半导体层(13),其形成在所述绝缘层(12)的背向所述硅衬底层(11)的表面上;其中,绝缘层(12)的厚度配置为,在正向偏置电压下,绝缘层(12)可以允许电子和空穴通过量子隧穿从绝缘层(12)的一侧通过到另一侧,从而允许正向电流流动。在反向偏置下,绝缘层(12)可以阻止自由电子和空穴的形成,从而阻止反向电流。因此,外延晶片能够具有仅允许电流在一个方向上通过的特性,并且可以制成用于电流整流元件的二极管等。

著录项

  • 公开/公告号EP3977514A1

    专利类型

  • 公开/公告日2022-04-06

    原文格式PDF

  • 申请/专利权人 UNIV SOUTH CHINA NORMAL;

    申请/专利号EP20190944002

  • 发明设计人 NOTZEL RICHARD;ZHOU GUOFU;

    申请日2019-09-11

  • 分类号H01L29/06;H01L29/88;H01L21/329;H01L21/02;B82Y40;

  • 国家 EP

  • 入库时间 2022-08-25 00:21:40

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