METHOD AND DEVICE FOR MACHINING A WAFER-HOLDING DEVICE FOR A WAFER LITHOGRAPHY PROCESS

摘要

The invention relates to a method for machining a wafer-holding device (10) for a wafer lithography process, such as immersion lithography or lithography under vacuum conditions, the wafer-holding device (10) comprising a carrier body (11) having an electrically conductive diamond cover layer (12). An electrochemical cell (20) is formed on the wafer-holding device (10) by the diamond cover layer (12), a counter electrode (21), an electrolyte liquid (22) in a gap between the diamond cover layer (12) and the counter electrode (21), and a voltage source (23) which is electrically connected to the diamond cover layer (12) and the counter electrode (21). Material is removed electrochemically on the wafer-holding device by means of the electrochemical cell (20). The invention also relates to a surface machining device (200) which is designed to machine a wafer-holding device (10) for a wafer lithography process.