PACKAGING STRUCTURE, ELECTRIC VEHICLE AND ELECTRONIC DEVICE

摘要

This application provides a packaging structure, an electric vehicle, and an electronic apparatus. The packaging structure includes: A first bonding layer is located between a first conductive surface of a first substrate and a first bonding surface of an electronic element, and is configured to implement bonding between the electronic element and the first substrate. The first bonding layer includes a first bonding material and at least one first support part, a height of the at least one first support part is the same as a thickness of the first bonding layer, and a melting point of the at least one first support part is higher than a maximum temperature at which the first bonding layer is formed, so that the first bonding layer has a flat surface and a uniform thickness. A second bonding layer is located between a second bonding surface of the electronic element and a first conductive surface of a second substrate, and is configured to implement bonding between the electronic element and the second substrate, and the first bonding surface of the electronic element is opposite to the second bonding surface of the electronic element. Therefore, good bonding of the first bonding layer is implemented, reliability of the packaging structure is improved, and manufacturing costs of the packaging structure are reduced.