首页> 外国专利> Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a target

Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a target

机译:基于来自目标喷射离子的分布调节目标倾斜角度的离子注入方法

摘要

The present disclosure describes a system and a method for a ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.
机译:本公开描述了一种用于离子注入(IMP)过程的系统和方法。 该系统包括离子注入器,该离子注入器被配置为在目标范围内扫描离子束,该倾斜机构被配置为支撑和倾斜目标的倾斜机构,被配置为收集分布的离子收集装置和来自的离子收集装置 离子束扫描在目标上,并且控制单元被配置为基于基于喷射离子的分布和数量确定的校正角来调节倾斜角度。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号