A wafer processing method that processes a wafer that has components on one side of the front surface. The method includes a wafer-with-protective component forming step in which the wafer with a protective component is formed by adhering the protective component formed of a heat-softening resin to the side of the front surface by pressing and heating the protective component A thickness measuring step in which the thickness of the protective component in the wafer with the protective component is measured, and a grinding step in which the wafer with the protective component is held by a chuck table and one side of the back surface of the wafer is ground until the thickness of the wafer reaches an intended final thickness. In the grinding step, the thickness of the protective component measured in the thickness measuring step is subtracted from a total thickness of the wafer with the protective component in order to calculate the thickness of the wafer.
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