首页> 外国专利> WAFER PROCESSING METHOD, WAFER PROCESSING SYSTEM, METHOD FOR MANUFACTURING EPITAXIAL WAFER, AND SYSTEM FOR MANUFACTURING THE EPITAXIAL WAFER

WAFER PROCESSING METHOD, WAFER PROCESSING SYSTEM, METHOD FOR MANUFACTURING EPITAXIAL WAFER, AND SYSTEM FOR MANUFACTURING THE EPITAXIAL WAFER

机译:晶片加工方法,晶片加工系统,制造外延晶片的方法和制造外延晶片的系统

摘要

PROBLEM TO BE SOLVED: To provide a wafer processing method that surely detects whether an unprocessed wafer is present, copes with irregular processing such as processing without a wafer, and prevents wafer loss such as transferring the unprocessed wafer to the next process, and also to provide a wafer processing system, and a method and system for manufacturing an epitaxial wafer.;SOLUTION: The wafer processing method is configured such that at least a plurality of wafers are stored in a cassette arranged inside a load lock chamber of a wafer processing device and the wafers are successively transferred from the cassette to a processing chamber so as to execute prescribed processing to the transferred wafers in a sheet feed manner. When the wafers are put into the cassette by a transfer device, the number of times N2 of wafer transfer from the cassette to the processing chamber is counted while counting the number of sheets N1 of wafers that are put into the cassette so as to determine whether N1 matches N2.;COPYRIGHT: (C)2011,JPO&INPIT
机译:要解决的问题:提供一种晶片处理方法,该方法能够确定是否存在未处理的晶片,应对不规则处理(例如不使用晶片的处理),并防止晶片损失(例如将未处理的晶片转移到下一工序),以及提供一种晶片处理系统以及用于制造外延晶片的方法和系统。解决方案:晶片处理方法被配置为使得至少多个晶片被存储在布置在晶片处理装置的加载锁定室内部的盒中。晶片被依次从盒传送到处理室,以便以片材进给的方式对被传送的晶片执行规定的处理。当通过传送装置将晶片放入盒中时,在对放入盒中的晶片的片数N1进行计数的同时,对从盒向处理室的晶片传送的次数N2进行计数,从而确定是否N1匹配N2 。;版权:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011009290A

    专利类型

  • 公开/公告日2011-01-13

    原文格式PDF

  • 申请/专利权人 SHIN ETSU HANDOTAI CO LTD;

    申请/专利号JP20090148899

  • 发明设计人 YAMADA TORU;

    申请日2009-06-23

  • 分类号H01L21/677;H01L21/205;C23C16/24;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:55

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