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Power silicon carbide based MOSFET transistors with improved short circuit capabilities and methods of making such devices

机译:基于碳化硅的MOSFET晶体管,具有改进的短路能力和制造此类设备的方法

摘要

A power MOSFET includes a silicon carbide drift region having a first conductivity type, first and second well regions located in upper portions of the silicon carbide drift region that are doped with second conductivity dopants, and a channel region in a side portion of the first well region, an upper portion of the channel region having the first conductivity type, wherein a depth of the first well region is at least 1.5 microns and the depth of the first well region exceeds a distance between the first and second well regions.
机译:功率MOSFET包括具有位于掺杂有第二导电掺杂剂的碳化硅漂移区的上部的第一导电类型,第一和第二阱区的碳化硅漂移区域,以及第一孔的侧部的侧部的沟道区 区域,具有第一导电类型的沟道区域的上部,其中第一阱区的深度为至少1.5微米,第一阱区的深度超过第一和第二阱区之间的距离。

著录项

  • 公开/公告号US11164967B2

    专利类型

  • 公开/公告日2021-11-02

    原文格式PDF

  • 申请/专利权人 CREE INC.;

    申请/专利号US201916538229

  • 发明设计人 QINGCHUN ZHANG;ALEXANDER V. SUVOROV;

    申请日2019-08-12

  • 分类号H01L29/78;H01L29/16;H01L21/265;H01L29/08;H01L29/10;H01L29/66;H01L29/06;H01L21/04;

  • 国家 US

  • 入库时间 2022-08-24 22:01:43

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