首页> 外国专利> A method for forming a silicon carbide polycrystalline film and a method for manufacturing a silicon carbide polycrystalline substrate.

A method for forming a silicon carbide polycrystalline film and a method for manufacturing a silicon carbide polycrystalline substrate.

机译:一种形成碳化硅多晶膜的方法及其制造碳化硅多晶衬底的方法。

摘要

PROBLEM TO BE SOLVED: To form a silicon carbide polycrystalline film having few voids to produce a silicon carbide polycrystalline substrate having few voids, and to manufacture a silicon carbide polycrystalline substrate. provide. A film-forming step of forming a silicon carbide polycrystal film on a support substrate by using a nitrogen gas, a silicon-based gas, a carbon-based gas, and a hydrogen gas by a chemical vapor phase growth method is included. The ratio of the number of atoms of the nitrogen atom of the nitrogen gas, the silicon atom of the silicon-based gas, the carbon atom of the carbon-based gas, and the hydrogen atom of the hydrogen gas used in the film forming step is N: Si: C: H = 40: 1: 1: 2 to 40: 1: 1: 20, and the flow rate of the hydrogen gas is in the range of 1 slm to 10 slm. [Selection diagram] Fig. 2
机译:要解决的问题:形成具有少量空隙的碳化硅多晶膜以产生具有少量空隙的碳化硅多晶衬底,并制造碳化硅多晶衬底。提供。包括通过使用氮气,硅基气体,碳基气体和氢气通过化学气相生长方法在支撑基板上形成碳化硅多晶膜的成膜步骤。氮气原子的原子数的比例,硅基气体的硅原子,碳基气体的碳原子,以及在成膜步骤中使用的氢气的氢原子是N:Si:C:H = 40:1:1:2至40:1:1:20,氢气的流速在1 SLM至10 SLM的范围内。 [选择图]图2

著录项

  • 公开/公告号JP2021085092A

    专利类型

  • 公开/公告日2021-06-03

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20190217433

  • 发明设计人 北川 泰三;

    申请日2019-11-29

  • 分类号C23C16/32;C30B29/36;C30B33/06;

  • 国家 JP

  • 入库时间 2022-08-24 19:12:56

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