Electroforming master and method for manufacturing electroformed molds using the electroforming master

摘要

Provided are an electroforming master that does not cause distortion in an electroforming mold, and a method for manufacturing an electroforming mold. In the present invention, an electroforming master having a relief pattern on a surface thereof is configured so as to be provided with a substrate having a flat surface and a Young's modulus of 50 GPa or greater, and a pattern film which has a Young's modulus of 10 GPa or less and in which a relief pattern is formed on the surface thereof. The flat surface of the substrate and the surface of the pattern film not provided with the relief pattern are affixed together by an adhesive layer over the entire surface thereof, the adhesion strength between the substrate and the pattern film due to the adhesive layer being 0.01 N/25 mm to 10 N/25 mm, or greater than 10 N/25 mm, and the adhesion strength being reducible to 10 N/25 mm or less by light irradiation or heat treatment of the adhesive layer.