CHIP PACKAGE STRUCTURE WITH INTEGRATED DEVICE INTEGRATED BENEATH THE SEMICONDUCTOR CHIP

摘要

A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip over the package substrate, and at least one integrated device integrated with the semiconductor chip. The integrated device is integrated directly beneath the semiconductor chip in order to facilitate signal transmission. Consequently, the signal integrity and the power integrity of the package structure are improved. In addition, the integrated device does not take up installation space over the package substrate, so the size of the package substrate and of the overall package structure can also be reduced.