首页> 外国专利> GROUP III-NITRIDE (III-N) DEVICES WITH REDUCED CONTACT RESISTANCE AND THEIR METHODS OF FABRICATION

GROUP III-NITRIDE (III-N) DEVICES WITH REDUCED CONTACT RESISTANCE AND THEIR METHODS OF FABRICATION

机译:III族氮化物(III-N)具有降低的接触电阻及其制造方法的装置

摘要

A device including a III-N material is described. In an example, the device has a terminal structure with a central body and a first plurality of fins, and a second plurality of fins, opposite the first plurality of fins. A polarization charge inducing layer including a III-N material in the terminal structure. A gate electrode is disposed above and on a portion of the polarization charge inducing layer. A source structure is on the polarization charge inducing layer and on sidewalls of the first plurality of fins. A drain structure is on the polarization charge inducing layer and on sidewalls of the second plurality of fins. The device further includes a source structure and a drain structure on opposite sides of the gate electrode and a source contact on the source structure and a drain contact on the drain structure.
机译:描述了一种包括III-N材料的装置。在一个示例中,该装置具有具有中心主体的端子结构和第一多个翅片,以及与第一多个翅片相对的第二多个翅片。偏振电荷诱导层,包括端子结构中的III-N材料。栅电极设置在偏振电荷诱导层的一部分上方和上方。源结构是在偏振电荷诱导层上和第一多个翅片的侧壁上。排水结构是偏振电荷诱导层和第二多个翅片的侧壁上。该装置还包括源结构和栅电极的相对侧的漏极结构和源结构上的源极和漏极结构上的漏极接触。

著录项

  • 公开/公告号US2021066293A1

    专利类型

  • 公开/公告日2021-03-04

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US201716643827

  • 申请日2017-09-29

  • 分类号H01L27/092;H01L29/20;H01L29/08;H01L29/66;H01L29/78;H01L21/8234;

  • 国家 US

  • 入库时间 2024-06-14 21:20:57

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