manufacturing process of thick film hybrid integrated circuits (and products thus obtained

摘要

1329052 Circuit assemblies RCA CORPORATION 25 May 1971 [6 July 1970] 16878/71 Heading H1B A method of making a hybrid circuit comprises the steps of depositing on an insulating base 2 a pattern of electrical conductors and circuit components, e.g. resistors, capacitors &c. and covering the base and circuitry with a thin layer of soft, elastic resin 116 having openings, e.g. 118, 120 at predetermined locations. Conductive ribbons, e.g. 134, 136, are then deposited upon layer 116 between other openings 122, 126 and 124, 128 and constitute jumper connections between portions of the lower circuitry. Additionally, further components, e.g. diodes 130, 132 are mounted, e.g. by soldering, on terminals located below openings 118, 120. The resulting assembly is encapsulated with a thick coating of hard resin, e.g. an epoxy. Prior to applying the hard resin coating, the jumper connection may be covered with resin of the same composition as layer 116. The jumper connections and the electrical conductors and circuit components of the lower circuitry may be deposited by screen printing. Certain components of the lower circuitry may be abrasively trimmed by leaving openings in layer 116. Insulating base 2 may be of ceramic or of any composition which is heat resistant, is a good thermal conductor, and has a low dielectric constant. Layer 116 may be composed of silicones, diallyl phthalate, polyimides or polyurethanes and may be transparent.