process for the production of a very thick thick film to control the thermal and live properties of hybrid integrated circuits

摘要

Disclosed is an ultra-thick thick film (30) of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate (32). A substrate (32) of suitable thickness is chosen to dissipate heat in the vertical, i.e., z-direction, underneath a heat-generating component such as a semiconductor chip (26). The ultra-thick films (30) have a thickness ranging from about 50.8 mu m (2 mils) to about 127 mu m (5 mils) and are prepared from metal powders having average particles sizes ranging from about 1 micrometre to 3 micrometres. IMAGE