PCT No. PCT/GB82/00066 Sec. 371 Date Sep. 23, 1982 Sec. 102(e) Date Sep. 23, 1982 PCT Filed Feb. 25, 1982 PCT Pub. No. WO82/02991 PCT Pub. Date Sep. 2, 1982.A method of treating copper foil for use in the production of printed circuit boards includes the step of depositing onto the copper foil a layer containing nodular or dendritic zinc in such a manner as to increase the bond strength of the foil with a base material compared with untreated foil.
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