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Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

机译:1,2,3-苯并三唑表面处理用钼酸钠后1,2,3-苯并三唑表面处理的电解铜箔的变色抗性

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摘要

The copper which an important component in the electronics industry, can suffer from discoloration and corrosion. The electrolytic copper foil was treated by 1,2,3-benzo-triazole (BTA) for an environmentally friendly non-chromate surface treatment. It was designed to prevent discoloration and improve corrosion resistance, consisted of BTA and inorganic sodium molybdate (Na2MoO4). Also the ratio of the constituent compounds and the deposition time were varied. Electrochemical corrosion of the Cu-BTA was evaluated using potentiodynamic polarization. Discoloration was analyzed after humidity and heat resistance conditioning. Surface characteristics were evaluated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Increasing corrosion potential and decreasing current density were observed with increasing Na2MoO4 content. A denser protective coating formed as the deposition time increased. Although chromate treatment under severe humidity (80% humidity, 80 °C, 100 h) provided the highest humidity resistance, surface treatment with Na2MoO4 had better heat discoloration inhibition under severe heat-resistant conditions (180 °C, 10 min). When BTA reacts with Cu to form the Cu-BTA-type insoluble protective film, Na2MoO4 accelerates the film formation without being itself adsorbed onto the film. Therefore, the addition of Na2MoO4 increased anticorrosive efficiency through direct/indirect action.
机译:电子工业中一家重要组成部分的铜可患上变色和腐蚀。通过1,2,3-苯并三唑(BTA)处理电解铜箔,用于环保的非铬酸盐表面处理。它旨在防止变色并改善耐腐蚀性,由BTA和无机钼酸钠(Na2Moo4)组成。还改变了组分化合物和沉积时间的比例。使用电位偏振评估Cu-BTA的电化学腐蚀。湿度和耐热性调节后分析了变色。使用扫描电子显微镜(SEM)和X射线光电子能谱(XPS)评估表面特性。随着Na2Moo4含量的增加,观察到增加腐蚀电位和电流密度降低。在沉积时间增加时形成更密集的保护涂层。虽然在严重湿度下的铬酸盐处理(80%湿度,80℃,100h)提供最高的湿度阻力,但用Na2Moo4的表面处理在严重的耐热条件下具有更好的热变色抑制(180℃,10分钟)。当BTA与Cu反应以形成Cu-BTA型不溶性保护膜时,Na2Moo4加速膜形成而不自身吸附在薄膜上。因此,通过直接/间接作用,添加Na2Moo4增加了防腐效率。

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