PROCESS FOR ENCAPSULATING MICRO-ELECTRONIC SEMI-CONDUCTOR AND LAYER-TYPE CIRCUITS

摘要

A process for encapsulating micro-electronic hybrid semi-conductor circuits or micro-electronic semi-conductor components, in which the components (B), located on a substrate (S), receive a soft, sealable poured-on plastic coating (W), are covered with a plastic/metal composite foil (F) and are, if necessary, then encapsulated with a hard synthetic-resin sealing compound (H) which is resistant to thermal shock. The external plastic layers of the foil combine with the filler or sealing compound and thus form an encapsulation which is temparature and moisture resistant.