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PLATING METHOD AND PLATING SOLUTION

机译:镀层方法和镀层解决方案

摘要

PURPOSE:To obtain uniform concluding plating by previously immersing a member to be plated in a plating soln. contg. a specified amt. each of nickel sulfamate and nickel citrate for a prescribed time and by supplying electric current to carry out nickel striking. CONSTITUTION:When a meshy electrode as a member to be plated is plated after nickel striking, a soln. contg. 2-4g/l each of nickel sulfamate and nickel citrate as essential components is used as a plating soln. for the nickel striking. The member is immersed in the plating soln. for =10sec, preferably about 10-30sec without supplying electric current and then electric current is supplied to carry out prescribed nickel striking. Thus, the nickel striking is improved and subsequently uniform plating is obtd.
机译:目的:通过预先将待镀部件浸入镀液中以获得均匀的最终镀层。续指定的amt。氨基磺酸镍和柠檬酸镍中的每一种在规定的时间内并通过提供电流进行镍撞击。组成:当敲击镍后将网状电极作为要镀的部件进行镀覆时,应使用锡溶液。续必需的氨基磺酸镍和柠檬酸镍中的2-4g / l用作电镀液。对于镍的打击。将该部件浸入电镀液中。 ≥10秒,优选约10-30秒,而不供应电流,然后供应电流以进行规定的镍撞击。因此,改善了镍的触击并且随后实现了均匀的镀覆。

著录项

  • 公开/公告号JPS63243294A

    专利类型

  • 公开/公告日1988-10-11

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP19870076045

  • 发明设计人 TAKEUCHI KAZUMA;

    申请日1987-03-31

  • 分类号C25D3/12;

  • 国家 JP

  • 入库时间 2022-08-22 07:08:05

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