TIN PLATING SOLUTION, PLATING METHOD USING THE TIN PLATING SOLUTION, METHOD FOR PREPARING TIN PLATING SOLUTION AND CHIP PARTS HAVING TIN PLATING LAYER FORMED BY USING THE TIN PLATING SOLUTION

摘要

Provided is a tin plating solution which is less susceptible to forming a sludge even after the storage for a long time and has a markedly long life as a plating solution. A tin plating solution for carrying out an electrolytic tin plating, characterized in that it contains a tin salt as a supply source of a tin ion in an amount of 5 to 30 g/L in terms of tin, a chelating agent for chelating and stabilizing the tin ion and a pH adjusting agent; and a method for preparing the tin plating solution, characterized in that it comprises adding tin methanesulfonate into a solution being neutral to alkaline, to thereby form a tin chelate complex.