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METHOD FOR PREPARING LOW-MELTING-POINT PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING, PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING, METHOD FOR PRODUCING ALUMINUM FOIL, AND METHOD FOR LOWERING MELTING POINT OF PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING
METHOD FOR PREPARING LOW-MELTING-POINT PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING, PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING, METHOD FOR PRODUCING ALUMINUM FOIL, AND METHOD FOR LOWERING MELTING POINT OF PLATING SOLUTION FOR ELECTRICAL ALUMINUM PLATING
An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25°C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5 + n to 4.2 + n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
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机译:本发明的一个目的是提供一种制备铝电镀用镀液的方法,该方法可用于以高成膜速率等生产高延展性,高纯度的铝箔等。 -处理镀液,该镀液即使在25°C时也不会固化并且可以进行电镀处理。作为实现上述目的的手段的本发明的特征在于,在制备至少包含(1)二烷基砜,(2)卤化铝和(3)含氮化合物的镀液时,进行混合。二烷基砜,卤化铝和含氮化合物的比例应使每10摩尔二烷基砜中的卤化铝为3.5 + n至4.2 + n mol,而含氮化合物为n mol(其中n为0.001至2.0mol)。另外,通过本发明的方法制备的用于铝电镀的电镀液允许相对于电流以高的铝沉积效率进行电镀处理,因此其优点在于可以减少用电量,从而导致优异的经济效率。 。
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