首页> 外国专利> Method for producing a laser diode having a buried active layer and lateral current limiting, and a laser diode having a buried active layer and lateral current limiting

Method for producing a laser diode having a buried active layer and lateral current limiting, and a laser diode having a buried active layer and lateral current limiting

机译:具有埋入式有源层和横向电流限制的激光二极管的制造方法以及具有埋入式有源层和横向电流限制的激光二极管

摘要

Laser diodes which are produced in only one epitaxial step have a longer life than those which are produced in a plurality of epitaxial steps with intermediate etching steps. Since the double heterostructure for laser diodes having a buried active layer is produced in only one epitaxial step, such that the active layer (33) grows in an interrupted manner by influencing the growth parameters, lateral layers (332) of the same material are produced on the side of the stripe (331) of the active layer (33), and the current must therefore be limited to the region of the stripe (331) of the active layer (33). This lateral current limiting is implemented by means of lateral channels (3322) between the buffer layer (32) and the semiconductor layer (34) on the side of the stripe (331) of the active layer (33). The lateral channels (3322) are produced by partially etching away the lateral layers (332) of the active layer (33), using an acid which attacks only the active layer (33) and leaves the buffer layer (32) and the semiconductor layer (34) undamaged, via transverse channels (341) running at right angles to the layer structure. IMAGE
机译:仅在一个外延步骤中制造的激光二极管比在多个中间蚀刻步骤中在多个外延步骤中制造的激光二极管具有更长的寿命。由于仅在一个外延步骤中产生具有掩埋的有源层的激光二极管的双异质结构,使得有源层(33)通过影响生长参数以间断的方式生长,因此产生了相同材料的侧向层(332)在有源层(33)的条(331)的侧面上,电流必须被限制在有源层(33)的条(331)的区域。通过在有源层(33)的条(331)的一侧上的缓冲层(32)和半导体层(34)之间的横向通道(3322)来实现这种横向电流限制。通过使用仅侵蚀活性层(33)并离开缓冲层(32)和半导体层的酸,通过部分蚀刻掉有源层(33)的横向层(332)而产生横向通道(3322)。 (34)通过与层结构成直角延伸的横向通道(341)没有损坏。 <图像>

著录项

  • 公开/公告号DE3713045A1

    专利类型

  • 公开/公告日1988-10-27

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19873713045

  • 发明设计人 THULKEWOLFGANGDR.RER.NAT.;

    申请日1987-04-16

  • 分类号H01S3/19;H01L33/00;H01L21/30;H01L21/20;

  • 国家 DE

  • 入库时间 2022-08-22 06:51:54

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