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PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING

机译:用于化学镀的光固化型抗蚀剂树脂组合物

摘要

PURPOSE:To improve plating liquid resistance by incorporating a multifunctional epoxy resin, specific phosphate compd. and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ester groups in 1mol. and in which the glycidyl ester groups are directly bonded to an arom. ring or cyclohexane ring, the phosphate compd. expressed by formula I and a photosensitive arom. onium salt. In formula I, R0 denotes an org. group having an epoxy group; R1 denotes an org. group having a radical polymerable functional group; R2 denotes an org. group except R0, R1; (a), (b) are 1 or 2; (c) is 0 or 1, and a+b+c=3. The plating liquid resistance is thereby improved.
机译:目的:通过加入多功能环氧树脂来提高电镀液的耐性,复合了特殊的磷酸盐。和光阳离子聚合物。启动器插入compsn。组成:本成分。含有在1mol中具有至少两个缩水甘油酯基的环氧树脂。并且其中缩水甘油酯基团直接键合到芳族基上。环或环己烷环上,则磷酸根残基。由式I和光敏芳烃表示。洋葱盐。式I中,R 0表示org。具有环氧基的基团; R 1表示org。具有自由基聚合性官能团的基团; R 2表示org。除R <0>,R <1>外的组; (a),(b)为1或2; (c)是0或1,并且a + b + c = 3。从而提高了耐镀液性。

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