PURPOSE:To manufacture a high strength and high conductivity copper alloy for electronic equipment excellent in thermal peeling resistance of solder by incorporating specified ratios of Cr, Sn and Mn into Cu and preparing a copper alloy. CONSTITUTION:A high strength and high conductivity copper alloy for electronic equipment contg., by weight, 0.2 to 1.0% Cr, 0.2 to 1.0% Sn and 0.1 to 0.8% Mn, or furthermore, as auxiliary components, contg. total 0.01 to 2.0% of one or = two kinds selected from the group consisting of Ag, Al, As, B, Be, Fe, Ge, Hf, In, Mo, Ni, Pb, Sb and V and the balance Cu with inevitable impurities and excellent in thermal peeling resistance of solder is prepd. More over, in this alloy, the content of 0 is preferably limited to =30ppm and the content of S to =20ppm.
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