Lead/read pin warping measurement equipment null of flat package forma

摘要

PURPOSE:To obtain a simple structure for measuring by image processing by capturing measurement points at different height with a camera at one time for a relative bending at a root part and a tip part in a gull wing type lead pin by providing each specific optical system and one camera, an image processing device, and an arithmetic operation output part. CONSTITUTION:The title item is a lead-pin bending measurement device of a flat-package type IC 8 which measures bending between a root part 81 and a tip part 82 in a gull wing type lead pin 80 of the flat-package type IC 8 and has one camera 3 which captures an optical system 2 including an objective lens 23 which is placed on a line L2 which is perpendicular to a segment L1 and image light at both measurement points 81a and 82a in the above which passes the optical system 2, an image processing device 4 which measures a distance in a lead pin width direction between both measurement points 81a and 82a which are captured by the camera 3, and an arithmetic operation output part 5 which outputs a distance a which is obtained by the image processing device 4.