Lead/read pin bending measuring method and device null of flat package type

摘要

PURPOSE:To enable distance between one point on a fixed part and one point on a pin edge part to be measured from an obtained image by shooting the flexed part and the pin edge part simultaneously with one outside camera device for each lead pin of an IC to be inspected which is placed at a specified inspection position. CONSTITUTION:Since a protruding part b of a lead pin P and the succeeding taper part c can be produced accurately and with relatively less scattering, a predetermined position on a flexed part e where parts b and c are continuous and a predetermined position on a pin edge d are determined to be measurement points, these measurement points are shot by a camera device 31, 32, 33, or 34, the image input to an image processing and measuring device, and distance between both measurement points obtained by the image-processing and measuring device, thus enabling binding of the lead pin to be detected. For example, a center point R1 of the flexed part e of the lead pin P and an upper edge center point R2 of a pin edge part face ds are determined to be measurement points, a plurality of lead pins at each side of the IC are shot in sequence at a time as in the case when inspecting floating of the lead pin so that these measurement points can be shot, and then the image is fed to the image-processing and measuring device 6.