MOLDING OF OUTER LEAD OF ELECTRONIC COMPONENT AND MOLDING DEVICE

摘要

PURPOSE: To obtain an electronic component outer lead molding method for performing a bend molding on the outer leads of an electronic component, such as an IC, with high precision and a molding device. ;CONSTITUTION: A molding device is constituted of a die 6 having support parts 6b for supporting base end parts 2a of outer leads 2 of an electronic component (an IC substrate) 1 and molding surfaces 6c for performing a bend molding on the leads 2, a lead press 4 for holding the base end parts 2a of the leads 2 in opposition to the support parts 6b of this die 6, elastic body punches 7, which are provided in opposition to the molding surfaces 6c of the die 6 and respectively have a tapered part 7b on each molding surface 6c, and pressing tools 8 for pressing these punches 7.;COPYRIGHT: (C)1993,JPO&Japio