Electronic packaging materials prepared by powder injecting molding and pressure infiltration process

摘要

AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder injection molding (PIM) and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained by pre-sintering process at 1150 K have high strength and good appearance, and the ratio of open porosity to total porosity is nearly 98%. The relative density of composites is bigger than 99%. The thermal conductivity of AlSiCp composites fabricated by this method is 198 Wm1K1, and the coefficient of thermal expansion (CTE) is 8.0 × 106/K (298 K).