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Dielectric vias within multi-layer 3-dimensional structures/substrates
Dielectric vias within multi-layer 3-dimensional structures/substrates
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机译:多层3维结构/基板中的介电过孔
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摘要
An array of dielectric vias formed in the insulating layers of a unitized multilayer circuit structure wherein the dielectric vias have a dielectric constant different from the dielectric constant of the insulating layers in which they are formed.
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