PURPOSE: To position and fix a semiconductor substrate and avoid its rotation to provide a compression-bonded semiconductor device whose reliability is improved. ;CONSTITUTION: Protrusions 12a are provided on the outer circumference of a resin ring 12 which protects the edge part of a semiconductor substrate 31. Recesses 13a are provided inside an insulating ring 13 and the protrusions 12a are mated with the recesses 13a to avoid the rotation of the semiconductor substrate 31 relative to the insulating ring 13 and to position and fix the semiconductor substrate 31 to the insulating ring 13. Further, recesses 13b and recesses 4a are provided outside the insulating ring 13 and an insulator cylinder 4 respectively. Support members 14 are fitted to spaces formed by both the recesses 13b and 4a to avoid the rotation of the insulating ring 13. As the insulating ring 13 is positioned to an external electrode, the semiconductor substrate 31 is positioned to the external electrode.;COPYRIGHT: (C)1995,JPO
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