COMPRESSION-BONDED SEMICONDUCTOR ELEMENT, ITS MANUFACTURE, AND COMPRESSION-BONDED SEMICONDUCTOR DEVICE

摘要

PURPOSE: To prevent permanent thermal breakdown by forming a ring gate terminal which protrudes from the side of an insulating cylinder and consists of a ring plate hermetically fixed to the insulating cylinder, the inner peripheral plane of which plate is arranged to be able to slide on a ring gate electrode. ;CONSTITUTION: An insulating cylinder 21 which is divided into an upper part and a lower part and has a protruding part 22 is so hermetically fixed to a divided part that the outer periphery of a ring gate terminal 27 protrudes outward from the side of the insulating cylinder 21. A gate current is applied from the outer periphery of the ring gate terminal 27 protruding from the side of the insulating cylinder 21, and isotropically supplied to a semiconductor substrate 8, so that permanent thermal breakdown is not generated. The inner peripheral plane of the ring gate terminal 27 constituted of a ring plate is arranged to be able to slide on a ring gate electrode 26. Thereby the mechanical stress applied to the ring gate electrode 26 which is caused by the thermal expansion of the ring gate terminal 27 is decreased, and local wear of a gate electrode 9a can be prevented.;COPYRIGHT: (C)1996,JPO