METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE UTILIZING MOLD FOR MOLDING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

摘要

PURPOSE: To provide a method for manufacturing the molding body of a semicon ductor package that is formed at an opening by utilizing a mold where a cavity and a projecting part are formed and a semiconductor package that is manufac tured by the method. ;CONSTITUTION: A semiconductor element 11 is adhered on a paddle of a lead frame 13, a semiconductor package in semi-assembly body shape being wire- bonded is inserted into the cavity of a lower mold, and an upper mold where a projecting part is formed covers the upper surface of the lower mold and is molded by molding resin, thus easily manufacturing a semiconductor package with an opening.;COPYRIGHT: (C)1994,JPO