MOLD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND A MOLDING METHOD OF THE SEMICONDUCTOR PACKAGE USING THE SAME, CAPABLE OF IMPROVING THE MOVEMENT OF A MOLD UNIT

摘要

PURPOSE: A mold for manufacturing a semiconductor package and a molding method of the semiconductor package using the same are provided to prevent the expose of a semiconductor chip and a void trap by preventing imbalance of a molding material quantity on the upper side and the lower side.;CONSTITUTION: A mold for manufacturing a semiconductor package includes a lower mold(102) and an upper mold(112). The lower mold includes a semiconductor package receiver(103) which receives the semiconductor package for a molding process. The upper mold is arranged on the upper side of the lower mold and includes a sidewall(104) arranged along the edges of the lower mold and a cover unit which vertically moves along the sidewall.;COPYRIGHT KIPO 2010