MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE SUBSTRATE, METAL MOLD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE, FEEDER FOR SEMICONDUCTOR PACKAGE SUBSTRATE, AND SEMICONDUCTOR PACKAGE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a BGA type semiconductor package substrate such that signal lines wired on a surface are electrically connected to solder balls on the lowest surface through inter-layer connections, an unnecessary feeder (stub) for electroplating adversely affecting electric characteristics being easily removed without increasing stages, i.e. costs.;SOLUTION: The semiconductor package substrate has a plurality of signal lines 118, wired on a surface, electrically connected to a plurality of solder balls 14 on the lowest surface through inter-layer connectors 15A, 15B, and 15C formed penetrating the semiconductor package substrate along the thickness. For at least a high-speed signal line of a plurality of signal lines 118 among feeders for forming the plurality of signal lines 118 by electroplating, outward extending portions of the inter-layer connectors 15A, 15B, and 15C of the feeders are disconnected by a metal mold used for formation of mold resin 18.;COPYRIGHT: (C)2008,JPO&INPIT