Method of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit pattern

摘要

A method of manufacturing a printed wiring board includes the following steps. A circuit pattern consisting of one material selected from the group consisting of copper and a copper alloy is selectively formed on an insulating substrate, and a solder resist is then formed on the insulating substrate except for a region in which the circuit pattern is formed. A copper oxide and a copper impurity produced on surfaces of the solder resist and the circuit pattern formed on the insulating substrate are removed. A copper oxide coating is uniformly formed on the surface of the circuit pattern from which the copper oxide and copper impurity are removed. A oxidation-proof coating consisting of an imidazole-based pre-flux is formed by substituting the copper oxide coating on the surface of the circuit pattern with imidazole.