With a carrier copper foil, a manufacturing method of a copper foil with a carrier, a printed circuit board, printed circuit boards, copper-clad laminate, and a method for manufacturing a printed wiring board

摘要

Is to provide a suitable carrier with copper foil to [challenge] fine pitch formation. [SOLUTION] The copper foil with carrier, after removing the thin copper layer electrode, Thickness A of ultra-thin copper layer before etching and (μm), the value C of the ratio equivalent thickness B of ultra-thin copper layer was removed by etching with (μm) thickness A very thin layer of copper (= before etching (μm equivalent thickness B of ultra-thin copper layer was removed by) / etching (μm)), C = 0.227 × log _e (A thickness of ultra-thin copper layer before etching (μm)) + 0.26 When the etching is performed on the separation surface side of the ultra-thin copper layer of the electrode until the copper residue of 10μm diameter or etching the surface of the thin copper layer is 5 pieces / dm ² or less the poles. [Selection Figure Figure 3