With a carrier copper foil, a manufacturing method of a copper foil with a carrier, a printed circuit board, printed circuit boards, copper-clad laminate, and a method for manufacturing a printed wiring board

摘要

[Challenge] high adhesion between the carrier and the ultra-thin copper foil before lamination process to insulating substrate, after the lamination process to the insulating substrate, can be easily peeled off the carrier and ultra-thin copper foil interface, and etching resistance is good The copper foil to provide with a carrier. A copper foil with carrier, the intermediate layer comprises Ni, when peeling the ultra-thin copper layer in accordance with the JISC6471, depth obtained from the surface analysis by XPS: Cr of (x units nm) atomic concentration (%) is defined as e (x), the concentration of Zn (percent), and f (x), the concentration of Ni (percent), and g (x), the concentration of Cu and (%) h (x) is defined as the concentration of oxygen (%) is defined as i (x), the concentration of carbon (%) is defined as j (x), and the other of the concentration (%) and k (x), an intermediate layer side of the ultrathin copper layer in the interval [0,1.0] in the depth direction analysis from the surface of, ∫g (x) dx / (∫e (x) dx + ∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) satisfies the 5.0% or less. [Selection Figure] Figure 2