APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR REDUCING PRESSURE IN PROCESSING CHAMBER METHOD FOR REMOVING REACTION PRODUCT, AND METHOD FOR PREVENTING DEPOSITION OF REACTION PRODUCT

摘要

PURPOSE: To remove reaction product from a workpiece without heating it by applying sonic waves to the workpiece and giving treatment while applying the sonic waves to the workpiece. ;CONSTITUTION: Chlorine 112 remaining as large amounts of reaction products through treatment is deposited on the surface of a wafer 111. After treatment, the wafer 111 is placed on a support 122 by using a carrier 72 and fixed by a clamp 121. Next, a chamber 3 is released to the atmosphere so that its atmosphere is replaced by the atmosphere and the pressure is returned to the atmospheric pressure. Then, electric signals are oscillated by an oscillator 142 and ultrasonic waves having a frequency of 45kHz are transmitted via the support 122 to the wafer 111. As a result, the chlorine 112 remaining as the reaction product is removed from the wafer 111. This enable the reaction product to be removed from the workpiece without heating the workpiece.;COPYRIGHT: (C)1996,JPO