Chamber wall heating device to prevent deposition of process by-products of reaction chamber for semiconductor manufacturing process

摘要

The present invention is to improve the yield of the wafer by effectively reducing the phenomenon that the process by-products are deposited on the chamber wall of the reaction chamber used in the deposition process for manufacturing a semiconductor device through the temperature control of the chamber wall.;To this end, the present invention is a heating member (4) which is respectively embedded in the gas injection ring (2) and the bellows cover (3) forming the chamber inner wall to heat the inner wall of the reaction chamber (1), and the reaction chamber (1) A plurality of temperature detecting means (5) installed on the inner wall of the chamber to detect the temperature of the inner wall, and receiving a detection signal of the temperature detecting means (5) so that the temperature of the inner wall of the reaction chamber (1) maintains a constant temperature 4. A chamber wall heating apparatus for preventing process by-product deposition of a reaction chamber for a semiconductor manufacturing process comprising a temperature control controller 6 for controlling a voltage applied to 4).