BGA PACKAGE, MOUNTING BOARD THEREFOR, SEMICONDUCTOR DEVICE COMPOSED THEREOF AND MOUNTING METHOD FOR BGA PACKAGE

摘要

PURPOSE: To ensure insulation between adjacent solders by disposing a spherical insulator, having height equal to or lower than that of a plurality of spherical solders, at least between two adjacent spherical solders. ;CONSTITUTION: A protrusion 16, having height equal to or lower than that of a solder ball 13, is formed between two adjacent solder balls 13 on one side of a package body 11. The protrusion 16 is made of an insulator and a plurality of linear protrusions 16, extending in the directions of column and row, are combined into a lattice where one solder ball 13 is arranged in each region sectioned by the protrusions 16. Since the protrusion 16 exists between two adjacent solder balls 13 of a BAG package, the adjacent solder balls are prevented from coming into contact regardless of the collapsed state (including over collapse) of the solder ball 13 thus ensuring the insulation.;COPYRIGHT: (C)1996,JPO