BGA PACKAGE, MOUNTING BOARD AND SEMICONDUCTOR DEVICE COMPOSED THEREOF

摘要

PURPOSE: To make uniform the collapse of spherical solders on a BGA package by forming protrusions, having height equal to or lower than that of a plurality of spherical solders, on one side of a package body. ;CONSTITUTION: Three protrusions 17A-17C are formed on one side of a package body 11. The protrusions 17A-17C are formed on the periphery of a package body 11 while being spaced apart by a predetermined distance from each other. The protrusion 17A-17C has columnar shape and the height thereof is set equal to or shorter than that of a solder ball 14. Since a BGA package is supported by the protrusions 17A-17C, the solder balls 14 can be collapsed uniformly at all times.;COPYRIGHT: (C)1996,JPO