BGA PACKAGE AND PRINTED CIRCUIT BOARD SUITED FOR MOUNTING BGA PACKAGE

摘要

PURPOSE: To prevent the excess crushing of solder balls when the solder balls are melted at the time of joining. ;CONSTITUTION: In a BGA package, in which solder balls 4 joined with a printed circuit board are fixed onto the rear of a substrate 2, at least three projections 5 abutted against the printed circuit board under the state, in which the solder balls 4 are melted and proper junctions with the printed circuit board are formed, are formed so that the BGA package 1 can be held horizontally on the printed circuit board, thus supporting the BGA package 1 by the projections 5 when the solder balls 4 are melted, then preventing the excess crushing of the solder balls 4.;COPYRIGHT: (C)1996,JPO